Apparatuses and methods for magnetic features of articles

ABSTRACT

Provided herein are apparatuses and methods related thereto, wherein at least one apparatus includes: a photon emitting means configured to emit photons, wherein the photons are scattered from magnetic features of an article; a photon detector array configured to receive scattered photons; and a processing means configured to differentiate the magnetic features from the scattered photons.

CROSS REFERENCE

This application claims the benefit of U.S. Provisional PatentApplication No. 61/829,160, filed May 30, 2013.

BACKGROUND

An article may be inspected for features, including defects that mightdegrade the performance of the article or a system including thearticle. For example, a hard disk for a hard disk drive may befabricated on a production line and inspected for defects that mightdegrade the performance of the disk or the hard disk drive. Accordingly,apparatuses and methods may be used to inspect articles for features.

SUMMARY

Provided herein are apparatuses and methods related thereto, wherein atleast one apparatus includes: a photon emitting means configured to emitphotons, wherein the photons are scattered from magnetic features of anarticle; a photon detector array configured to receive scatteredphotons; and a processing means configured to differentiate the magneticfeatures from the scattered photons.

These and other features and aspects of the concepts provided herein maybe better understood with reference to the following drawings,description, and appended claims.

DRAWINGS

FIG. 1 provides a schematic illustrating detection of features ofarticles according to one or more aspects.

FIG. 2A provides a schematic illustrating photon scattering from asurface feature of an article according to one or more aspects.

FIG. 2B provides a schematic illustrating photon scattering from amagnetic feature of a portion of an article according to one or moreaspects.

FIG. 3 provides a schematic illustrating photons scattering from asurface feature of an article, through an optical component, and onto aphoton detector array according to one or more aspects.

FIG. 4A provides an image of a surface features map of an articleaccording to one or more aspects.

FIG. 4B provides a close-up image of a surface features map of anarticle according to one or more aspects.

FIG. 4C (top) provides a close-up image of a surface feature of asurface features map, and FIG. 4C (bottom) provides a photon scatteringintensity distribution of the surface feature, according to one or moreaspects.

FIG. 4D (top) provides a close-up, pixel-interpolated image of a surfacefeature of a surface features map, and FIG. 4D (bottom) provides aphoton scattering intensity distribution of the pixel-interpolatedsurface feature, according to one or more aspects.

FIG. 5A provides a schematic illustrating a lack of photon scatteringfrom a magnetic anomaly of a portion of an article according to one ormore aspects.

FIG. 5B provides an image of a magnetic features map of an articleaccording to one or more aspects.

FIG. 5C provides an image of a magnetic features map and magnetic forcemicroscopy images of an article according to one or more aspects.

FIG. 6 provides a schematic illustrating photon scattering from amagnetic anomaly of a portion of an article according to one or moreaspects.

DESCRIPTION

Before some particular embodiments are described and/or illustrated ingreater detail, it should be understood by persons having ordinary skillin the art that the particular embodiments described and/or illustratedherein do not limit the concepts provided herein, as features in suchparticular embodiments may vary. It should likewise be understood that aparticular embodiment described and/or illustrated herein has featuresthat may be readily separated from the particular embodiment andoptionally combined with or substituted for features in any of severalother embodiments described and/or illustrated herein.

It should also be understood by persons having ordinary skill in the artthat the terminology used herein is for the purpose of describing someparticular embodiments, and the terminology does not limit the conceptsprovided herein. Unless indicated otherwise, ordinal numbers (e.g.,first, second, third, etc.) are used to distinguish or identifydifferent elements or steps in a group of elements or steps, and do notsupply a serial or numerical limitation. For example, “first,” “second,”and “third” elements or steps need not necessarily appear in that order,and embodiments need not necessarily be limited to the three elements orsteps. It should also be understood that, unless indicated otherwise,any labels such as “left,” “right,” “front,” “back,” “top,” “bottom,”“forward,” “reverse,” “clockwise,” “counter clockwise,” “up,” and“down,” or other similar terms such as “upper,” “lower,” “aft,” “fore,”“vertical,” “horizontal,” “proximal,” and “distal,” or the like, areused for convenience and are not intended to imply, for example, anyparticular fixed location, orientation, or direction. Instead, suchlabels are used to reflect, for example, relative location, orientation,or direction. It should also be understood that the singular forms of“a,” “an,” and “the” include plural references unless the contextclearly dictates otherwise.

Unless defined otherwise, all technical and scientific terms used hereinhave the same meaning as commonly understood by persons having ordinaryskill in the art.

An article may be inspected for features, including defects that mightdegrade the performance of the article or a system including thearticle. For example, a hard disk for a hard disk drive may befabricated on a production line and inspected for defects that mightdegrade the performance of the disk or the hard disk drive. Providedherein are apparatuses and methods for inspecting articles for features,including detecting, mapping, and/or distinguishing features ofarticles, which features include, but are not limited to, surfacefeatures and magnetic features.

With respect to articles that may be inspected with apparatuses andmethods provided herein, such articles include any article ofmanufacture or a workpiece thereof in any stage of manufacture havingone or more surfaces (e.g., one or more optically smooth surfaces),examples of which include, but are not limited to, semiconductor wafers,magnetic recording media (e.g., hard disks for hard disk drives), andworkpieces thereof in any stage of manufacture. Such articles may beinspected for features such as surface features, including surfaceand/or subsurface defects that might degrade the performance of thearticle, which surface and/or subsurface defects include particle andstain contamination, as well as defects including scratches and voids.Alternatively or additionally, such articles may be inspected forfeatures such as magnetic features, including magnetic anomalies thatmight degrade the performance of the article. As such, it is importantto inspect articles with apparatuses and methods provided herein tocorrect manufacturing trends and to increase product quality.

FIG. 1 provides a basis from which to begin a description of features ofthe apparatuses and methods provided herein. In view of the foregoing,FIG. 1 provides a non-limiting schematic for detecting, mapping, and/ordistinguishing features of articles illustrating an apparatus 100including a photon emitter 110, an optical setup 120 including anoptical component, a photon detector array 130, a computer or equivalentdevice 140, an optional stage 150 configured to support an article 160and/or rotate an article 160 with respect to the photon emitter 110, anda features map 170 of the article 160. As such, FIG. 1 provides a basisfrom which to begin a description of photon emitters, optical componentsof the optical setup, photon detector arrays, etc. The apparatuses andmethods provided herein are not limited to FIG. 1, as additionalembodiments are provided herein, and additional embodiments may berealized by the features provided in more detail herein.

An apparatus may include a single photon emitter (e.g., photon emitter110 of FIG. 1) to emit photons onto a surface of an article, such as theentire surface of the article or some predetermined portion of thesurface of the article (e.g., for gradational rotation of the articlefor piecewise inspection, if desired). Alternatively, the apparatus mayinclude a number of photon emitters (e.g., arranged at regular intervalsaround the optional stage 150 and/or the article 160 of FIG. 1) toindividually emit photons onto the surface of the article, such as theentire surface of the article or some predetermined portion of thesurface of the article, at different times and/or at the same time inany collection of photon emitters. In some non-limiting embodiments, forexample, the apparatus may include at least 1, 2, 3, 4, 5, 6, 7, 8, 9,or 10 photon emitter(s). In some non-limiting embodiments, for example,the apparatus may include no more than 10, 9, 8, 7, 6, 5, 4, 3, 2, or 1photon emitter(s). Combinations of the foregoing may also be used todescribe the number of photon emitters of the apparatus. In somenon-limiting embodiments, for example, the apparatus may include atleast 2 photon emitters and no more than 10 photon emitters (e.g.,between 2 and 10 photon emitters), such as at least 2 photon emittersand no more than 6 photon emitters (e.g., between 2 and 6 photonemitters), including at least 2 photon emitters and no more than 4photon emitters (e.g., between 2 and 4 photon emitters). Each photonemitter of a number of photon emitters may be the same or different, orsome combination thereof (e.g., at least 2 of the same photon emitter,with the remainder of photon emitters being different; at least 4 of thesame photon emitter, with the remainder of photon emitters beingdifferent; etc.). In some non-limiting embodiments, for example, theapparatus may include at least two different photon emitters, whereinthe two different photon emitters are each separately configured to emitphotons onto a surface of an article, such as the entire surface of thearticle or some predetermined portion of the surface of the article.

Whether the apparatus includes a single photon emitter or a number ofphoton emitters, each photon emitter may emit photons onto a surface ofan article at one or more distances and/or angles optimized for one ormore types of features, which types of features are described in moredetail herein. One angle may be equal to the glancing angle, which isthe complement of the angle of incidence, and which angle of incidenceis the angle between a ray including the emitted photons incident on thesurface of the article and the normal (e.g., a line or vectorperpendicular to the surface of the article) at the point at which theray is incident. The glancing angle may also be described as analtitudinal angle or the smallest angle between a ray including theemitted photons incident on the surface of the article and the surfaceat the point at which the ray is incident.

FIGS. 2A and 2B provide a number of rays including emitted photons orhv_(incident) incident on a surface 162 of an article 160, or a portionthereof, that form a glancing angle with the surface 162. FIG. 2Afurther provides a number of rays including reflected photons orhv_(reflected) that form an angle of reflection with the normal to thesurface, which angle of reflection is equal in magnitude to the angle ofincidence. FIG. 2A even further provides a number of rays includingscattered photons or hv_(scattered) from a feature 164 (e.g., surfacefeature) on the surface 162 of the article 160, which rays includingscattered photons form various scatter angles. Like FIG. 2A, FIG. 2Balso provides a number of rays including scattered photons orhv_(scattered) forming various scatter angles; however, the feature 164from which the scattered photons are scattered is a magnetic featurerepresented by an example magnetic field line of a number of magneticfield lines.

A photon emitter may emit photons at a glancing angle ranging from 0° to90°, inclusive, wherein a glancing angle of 0° represents the photonemitter emitting photons onto the surface of the article from a side ofthe article, and wherein a glancing angle of 90° represents the photonemitter emitting photons onto the surface of the article from directlyabove the article. In some non-limiting embodiments, for example, aphoton emitter may emit photons onto a surface of an article such thatthe glancing angle is at least 0°, 5°, 10°, 15°, 20°, 25°, 30°, 35°,40°, 45°, 50°, 55°, 60°, 65°, 70°, 75°, 80°, 85°, or 90°. In somenon-limiting embodiments, for example, a photon emitter may emit photonsonto a surface of an article such that the glancing angle is no morethan 90°, 85°, 80°, 75°, 70°, 65°, 60°, 55°, 50°, 45°, 40°, 35°, 30°,25°, 20°, 15°, 10°, 5°, or 0°. Combinations of the foregoing may also beused to describe the glancing angle at which a photon emitter may emitphotons onto a surface of an article. In some non-limiting embodiments,for example, a photon emitter may emit photons onto a surface of anarticle such that the glancing angle is at least a 0° and no more than90° (i.e., between 0° and 90°), such as at least 0° and no more than 45°(i.e., between 0° and 45°), including at least 45° and no more than 90°(i.e., between 45° and 90°).

A photon emitter may emit photons onto a surface of an article, such asthe entire surface or some predetermined portion of the surface (e.g.,for gradational rotation of the article for piecewise inspection, ifdesired). The photon emitter may further emit photons onto the entiresurface of the article or some predetermined portion of the surface suchthat the entire surface or the predetermined portion of the surface isuniformly or homogenously illuminated. Uniformly illuminating the entiresurface of the article or some predetermined portion of the surfaceincludes, but is not limited to, subjecting the entire surface of thearticle or some predetermined portion of the surface of the article tothe same or about the same quantity of photons per unit time (e.g.,photon flux), the same or about the same photon energy per unit time(e.g., photon power), and/or the same or about the same photon power perunit area (e.g., photon power density or photon flux density). Inradiometric terms, uniformly illuminating includes, but is not limitedto, subjecting the entire surface of the article or some predeterminedportion of the surface of the article to the same or about the samequantity of light per unit time, the same or about the same radiantenergy per unit time (e.g., radiant power or radiant flux), and/or thesame or about the same radiant power per unit area (e.g., irradiance orradiant flux density).

With the appreciation that photons are the elementary particles ofelectromagnetic radiation or light, a photon emitter or a light sourcemay provide light including a relatively wide range of wavelengths(e.g., whole spectrum, broad spectrum, ultraviolet-visible, visible,infrared, etc.), a relatively narrow range of wavelengths (e.g., asubdivision of ultraviolet such as UVA, UVB, UVC, etc.; a subdivision ofvisible such as red, green, blue, etc.; a subdivision of infrared suchas near infrared, mid-infrared; etc.), or a particular wavelength (e.g.,monochromatic); light including a relatively wide range of frequencies(e.g., whole spectrum, broad spectrum, ultraviolet-visible, visible,infrared, etc.), a relatively narrow range of frequencies (e.g., asubdivision of ultraviolet such as UVA, UVB, UVC, etc.; a subdivision ofvisible such as red, green, blue, etc.; a subdivision of infrared suchas near infrared, mid-infrared; etc.), or a particular frequency (e.g.,monochromatic); polarized (e.g., linear polarization, circularpolarization, etc.) light, partially polarized light, or nonpolarizedlight; and/or light with different degrees of temporal and/or spatialcoherence ranging from coherent light (e.g., laser) to noncoherentlight. A photon emitter or a light source may be used in conjunctionwith one or more optical components of an optical setup to provide lighthaving any of the foregoing qualities. Wavelength filters, for example,may be used in conjunction with a photon emitter or a light source toprovide light including a relatively wide range of wavelengths orfrequencies, a relatively narrow range of wavelengths or frequencies, ora particular wavelength or frequency. Polarization filters, for example,may also be used in conjunction with a photon emitter or a light sourceto provide light of a desired polarization including polarized light,partially polarized light, or nonpolarized light. In some embodiments,for example, a photon emitter may provide photons of a relatively narrowrange of wavelengths or a certain wavelength, the longer thewavelength(s) for which narrow range of wavelengths or certainwavelength the better the scattering of photons from surface featuresand/or magnetic features.

In view of the foregoing, a photon emitter or light source may include alamp such as a flash lamp, including a high-speed flash lamp, configuredto minimize vibration while detecting photons scattered from features ofan article with a photon detector array. In some non-limitingembodiments, for example, a photon emitter or light source may include ahigh-speed Xe flash lamp such as a 500 W Xe flash lamp to minimizevibration while detecting photons scattered from features of an articlewith a photon detector array.

Also in view of the foregoing, a photon emitter or light source mayinclude a collimated light source such as a laser, including acombination of lasers, configured to emit photons onto a surface of anarticle at one or more angles. In some non-limiting embodiments, forexample, a combination of lasers may be provided to a laser beam shapersuch that the combination of lasers emits photons onto a surface of anarticle at one angle. In some non-limiting embodiments, for example, acombination of lasers may be provided to a laser beam shaper such thatthe combination of lasers emits photons onto a surface of an article atmultiple angles. In some non-limiting embodiments, for example, at least2, 4, 6, 8, 10, 12, 14, 16, 18, 20, 22, 24, 26, 28, or 30 lasers, oreven more than 30 lasers, may be provided to a laser beam shaper suchthat the combination of lasers emits photons onto a surface of anarticle at one or more angles. In some non-limiting embodiments, forexample, no more than 30, 28, 26, 24, 22, 20, 18, 16, 14, 12, 10, 8, 6,4, or 2 lasers may be provided to a laser beam shaper such that thecombination of lasers emits photons onto a surface of an article at oneor more angles. Combinations of the foregoing may also be used todescribe combinations of lasers provided to a laser beam shaper. In somenon-limiting embodiments, for example, at least 2 lasers and no morethan 30 lasers (e.g., between 2 and 30 lasers), such as at least 10lasers and no more than 30 lasers (e.g., between 10 and 30 lasers),including at least 20 lasers and no more than 30 lasers (e.g., between20 and 30 lasers), and further including at least 24 lasers and no morethan 28 lasers (e.g., between 24 and 28 lasers) may be provided to alaser beam shaper such that the combination of lasers emits photons ontoa surface of an article of an article at one or more angles.

Further in view of the foregoing, a photon emitter or light source mayinclude a two-dimensional light source such as a combination of pointlight sources, including a linear combination or array, an arcuatecombination or array, etc. of point light sources configured to emitphotons onto a surface of an article. In some non-limiting embodiments,for example, a two-dimensional light source may include a combination ofat least 10, 20, 40, 60, 80, 100, 110, 120, 140, 160, 180, or 200 pointlight sources, or even more than 200 point sources. In some non-limitingembodiments, for example, a two-dimensional light source may include acombination of no more than 200, 180, 160, 140, 120, 100, 80, 60, 40,20, or 10 point light sources. Combinations of the foregoing may also beused to describe two-dimensional light sources including combinations ofpoint light sources. In some non-limiting embodiments, for example, atwo-dimensional light source may include a combination of at least 10and no more than 200 (e.g., between 10 and 200) point light sources,such as at least 40 and no more than 160 (e.g., between 40 and 160)point light sources, including at least 60 and no more than 140 (e.g.,between 60 and 140) point light sources, and further including at least80 and no more than 120 (e.g., between 80 and 120) point light sources.Such point light sources may be combined in rows and columns of atwo-dimensional array, including linearly combined to form atwo-dimensional light source such as a strip light. Such point lightsources may be arcuately combined to form a two-dimensional light sourcesuch as a ring light. In some non-limiting embodiments, for example, aphoton emitter or light source may include a two-dimensional lightsource including at least 60 point light sources, such as a ring lightincluding at least 60 point light sources, optionally a ring lightincluding at least 60 light-emitting diodes (“LEDs”), and furtheroptionally a ring light including at least 100 LEDs. A two-dimensionallight source including LEDs may include white LEDs, wherein each LED hasa power of at least 10 mW. An LED-based ring light may enhance featuressuch as scratches (e.g., circumferential scratches) and/or voids insurfaces of articles, especially when the LED-based ring light isconfigured to emit photons onto the surfaces of the articles with lowerangles (e.g., glancing angle equal to or less than 45°).

The apparatus may further include a rotatable stage (e.g., rotatablestage 150 of FIG. 1) configured to gradationally rotate or continuouslyrotate an article through a number of rotational angles with respect toa photon emitter. Because some surface features differentially scatterphotons under different rotational angles, for example, on account oftheir faceted surfaces, rotating an article through a number ofrotational angles allows for such surface features to be detected,mapped, and/or distinguished. And, surprisingly, because magneticfeatures scatter photons orthogonally incident upon the magneticfeatures or certain magnetic field lines thereof, rotating an articlethrough a number of rotational angles allows for such magnetic featuresto be detected, mapped, and/or distinguished. With respect togradational rotation, an article may be sequentially rotated on therotatable stage through a number of rotational angles, and the photonemitter may sequentially (or continuously) emit photons onto the surfaceof the article at each successive rotational angle. With respect tocontinuous rotation, an article may be continuously rotated on therotatable stage through a number of rotational angles, and the photonemitter may continuously emit photons onto the surface of the article.Whether under gradational rotation or continuous rotation, photonsscattered from the article's features at the number of rotational anglesmay be subsequently detected by the photon detector array (e.g., photondetector array 130 of FIG. 1). A features map (e.g., features map 170 ofFIG. 1), or the information sufficient to produce such a features map,for each of the number of rotational angles may provide a set ofdifferential features maps (e.g., 170A, 170B, 170C . . . 170 n, whereinthe index n indicates the n^(th) features map from the n^(th) rotationalangle) that may be used to detect, map, and/or distinguish surfacefeatures and/or magnetic features that differentially scatter photonsunder different rotational angles. One or more composite features maps(e.g., one or more composite surface features maps, one or morecomposite magnetic features maps, or one or more composite surfacefeatures and magnetic features maps) may be generated from thedifferential features maps, or the information sufficient to producesuch differential features maps, providing one or more compositefeatures maps from any of a number of rotational angles, including allpossible rotational angles.

The apparatus may further include an optical setup (e.g., optical setup120 of FIG. 1 including one or more optical components), which opticalsetup may manipulate photons emitted from one or more photon emitters,photons reflected from a surface of an article, and/or photons scatteredfrom features of an article. With the appreciation that photons are theelementary particles of electromagnetic radiation or light, the opticalsetup may manipulate light emitted from one or more photon emitters,light reflected from a surface of an article, and/or light scatteredfrom features of an article. The optical setup up may include any of anumber of optical components positioned before the article such that theoptical components may be used to manipulate photons emitted from one ormore photon emitters before uniformly or homogenously illuminating theentire surface or the predetermined portion of the surface of thearticle. Alternatively or additionally, the optical setup up may includeany of a number of optical components positioned after the article suchthat the optical components may be used to manipulate photons reflectedfrom the surface of the article or scattered from features of thearticle. Alternatively or additionally, an optical component includingthe article (e.g., article 160 of FIG. 1) may be used to manipulate(e.g., reflect) photons. The forgoing optical components may include,but are not limited to, optical components such as lenses, filters,gratings, and mirrors, which mirrors include articles having opticallysmooth surfaces.

With respect to optical components such as lenses, the optical setup mayinclude a single lens or a number of lenses, including, but not limitedto, a combination of a lens coupled to a photon detector array (e.g.,the lens of the optical setup 120 coupled to the photon detector array130 of FIG. 1) configured for collecting and detecting photons scatteredfrom features of articles. The lens coupled to the photon detector arraymay have an entrance pupil and an exit pupil, and additional opticalcomponents such as lenses (e.g., lenses in addition to the lens coupledto the photon detector array), filters, gratings, and mirrors, may bepositioned in any combination of one or more optical components at ornear the entrance pupil of the lens coupled to the photon detectorarray, at or near the exit pupil of the lens coupled to the photondetector array (i.e., in-between the exit pupil of the lens and thephoton detector array), or some combination thereof to manipulatephotons scattered from features of articles. The lens coupled to thephoton detector array may be an objective lens, such as a telecentriclens, including an object-space telecentric lens (i.e., entrance pupilat infinity), an image-space telecentric lens (i.e., exit pupil atinfinity), or a double telecentric lens (i.e., both pupils at infinity).Coupling a telecentric lens to a photon detector array reduces errorswith respect to the position of features of articles, reduces distortionof features of articles, enables quantitative analysis of photonsscattered from features of articles, which quantitative analysisincludes integration of photon scattering intensity distribution forsize determination of features of articles.

With respect to optical components such as filters, the optical setupmay include a filter or a number of filters including, but not limitedto, one or more wavelength filters, band-pass filters, polarizationfilters, coherence filters, periodic array-tuned filters, and phasefilters. As described herein, when one or more of such filters ispositioned before an article to manipulate photons emitted from a photonemitter, photons/light having any of a number of different qualities maybe provided to a surface of the article. When one or more of suchfilters is positioned after an article to manipulate photons scatteredfrom features of the article, the one or more filters may be used fordistinguishing features of the article. For example, a wavelength filtermay be used to distinguish features that differentially scatter photonswith respect to wavelength; a polarization filter may be used todistinguish features that differentially scatter photons with respect topolarization; a coherence filter may be used to distinguish featuresthat differentially scatter photons with respect to coherence; and aphase filter or waveplate may be used to distinguish features thatdifferentially scatter photons with respect to phase. In somenon-limiting embodiments, for example, an optical component such as afilter may be positioned at or near the entrance pupil of a lens (e.g.,telecentric lens) coupled to a photon detector array. In somenon-limiting embodiments, for example, an optical component such as afilter may be positioned at or near the exit pupil of a lens (e.g.,telecentric lens) coupled to a photon detector array.

With respect to optical components including reflective surfaces such asmirrors, the optical setup may include one or more mirrors of anycurvature including, but not limited to, one or more mirrors selectedfrom optical-grade mirrors and one-way mirrors, including articlesincluding optically smooth surfaces. The one or more mirrors may bepositioned about an apparatus to manipulate photons emitted from one ormore photon emitters, reflected from a surface of an article, scatteredfrom features of an article, or combinations thereof. As such, the oneor more mirrors may be positioned in a light path before an article(e.g., a one-way mirror between a photon emitter and the article); inthe light path after an article; or in combinations thereof. In somenon-limiting embodiments, for example, one or more mirrors may be usedto redirect photons reflected off a surface of an article back onto thesurface of the article, thereby recycling photons that would otherwisebe lost to the environment.

The apparatus may further include a single photon detector array (e.g.,photon detector array 130 of FIG. 1) including a number of photondetectors to detect photons scattered from features of articles.Alternatively, the apparatus may further include a number of photondetector arrays, each including a number of photon detectors. In somenon-limiting embodiments, for example, the apparatus may include atleast 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10 photon detector array(s). In somenon-limiting embodiments, for example, the apparatus may include no morethan 10, 9, 8, 7, 6, 5, 4, 3, 2, or 1 photon detector array(s).Combinations of the foregoing may also be used to describe the number ofphoton detector arrays of the apparatus. In some non-limitingembodiments, for example, the apparatus may include at least 1 photondetector array and no more than 10 photon detector arrays (e.g., between1 and 10 photon detector arrays), such as at least 2 photon detectorarrays and no more than 5 photon detector arrays (e.g., between 2 and 5photon detector arrays). Each photon detector array of a number ofphoton detector arrays may be the same or different, or some combinationthereof (e.g., at least 2 of the same photon detector array, with theremainder of photon detector arrays being different; at least 3 of thesame photon detector array, with the remainder of photon detector arraysbeing different; etc.).

Whether the apparatus includes a single photon detector array or anumber of photon detector arrays, each photon detector array may beoriented to detect photons scattered from features of an article at oneor more distances and/or angles for an optimum acceptance of thescattered photons (e.g., maximum acceptance of the scattered photonswith minimum background noise, including noise from reflected photons)from one or more types of features, which types of features aredescribed in more detail herein. Likewise, alens-and-photon-detector-array combination may be oriented to collectand detect photons scattered from features of an article at one or moredistances and/or angles for an optimum acceptance of the scatteredphotons from one or more types of features. One angle may be the anglebetween a ray including the center line axis of the lens and/or thephoton detector array extended to the surface of the article and thenormal (e.g., a line or vector perpendicular to the surface of thearticle) at the point at which the ray is extended. The angle,optionally in combination with an aperture that may be optimally sizedfor maximum acceptance of the scattered photons with minimum backgroundnoise, including noise from reflected photons, or optionally incombination with an aperture that may be variably sized, such as morewidely sized or more narrowly sized to respectively accept a wider rangeor narrower range of the scattered photons, may be oriented to allow foracceptance of the scattered photons having a number of scatter angles,which scattered photons may be scattered from one or more types offeatures. A scatter angle may be different than the angle of reflection,which angle of reflection is equal in magnitude to the angle ofincidence as described herein. FIG. 2A provides a number of raysincluding photons scattered from a feature 164 on a surface 162 of anarticle 160, which rays represent various scatter angles.

In view of the foregoing, the angle at which a photon detector array ora lens-and-photon-detector-array combination may be oriented ranges from0° to 90°, inclusive, wherein an angle of 0° represents orientation ofthe photon detector array or the lens-and-photon-detector-arraycombination directly above the article, and wherein an angle of 90°represents orientation of the photon detector array or thelens-and-photon-detector-array combination at a side of an article. Insome non-limiting embodiments, for example, a photon detector array or alens-and-photon-detector-array combination may be oriented at an angleof at least 0°, 5°, 10°, 15°, 20°, 25°, 30°, 35°, 40°, 45°, 50°, 55°,60°, 65°, 70°, 75°, 80°, 85°, or 90°. In some non-limiting embodiments,for example, a photon detector array or a lens-and-photon-detector-arraycombination may be oriented at an angle of no more than 90°, 85°, 80°,75°, 70°, 65°, 60°, 55°, 50°, 45°, 40°, 35°, 30°, 25°, 20°, 15°, 10°, or5°, or 0°. Combinations of the foregoing may also be used to describethe angle at which the photon detector array or thelens-and-photon-detector-array combination may be oriented. In somenon-limiting embodiments, for example, a photon detector array or alens-and-photon-detector-array combination may be oriented at an angleof at least a 0° and no more than a 90° (i.e., between 0° and 90°), suchas least 0° and no more than 45° (i.e., between 0° and 45°) or at least45° and no more than 90° (i.e., between 45° and 90°).

The photon detector array, optionally in combination with a lens (e.g.,telecentric lens), may detect photons scattered from features of anarticle, such as the entire surface of the article or some predeterminedportion of the surface of the article. The photon detector array,optionally in combination with a lens (e.g., telecentric lens), maydetect photons scattered from features of an article, such as the entiresurface of the article or some predetermined portion of the surface ofthe article, while oriented at a distance and/or an angle for an optimumacceptance of the scattered photons (e.g., maximum acceptance of photonswith minimum background noise, including noise from reflected photons)from one or more types of features. As provided herein, the angle for anoptimum acceptance of the scattered photons from one or more types offeatures may allow for acceptance of scattered photons respectivelyhaving a number of scatter angles, which scattered photons mayrespectively be scattered from one or more types of features.

With the appreciation that photons are the elementary particles ofelectromagnetic radiation or light, a photon detector array or a lightdetector array may detect light including a relatively wide range ofwavelengths (e.g., whole spectrum, broad spectrum, ultraviolet-visible,visible, infrared, etc.), a relatively narrow range of wavelengths(e.g., a subdivision of ultraviolet such as UVA, UVB, UVC, etc.; asubdivision of visible such as red, green, blue, etc.; a subdivision ofinfrared such as near infrared, mid-infrared; etc.), or a particularwavelength (e.g., monochromatic); light including a relatively widerange of frequencies (e.g., whole spectrum, broad spectrum,ultraviolet-visible, visible, infrared, etc.), a relatively narrow rangeof frequencies (e.g., a subdivision of ultraviolet such as UVA, UVB,UVC, etc.; a subdivision of visible such as red, green, blue, etc.; asubdivision of infrared such as near infrared, mid-infrared; etc.), or aparticular frequency (e.g., monochromatic); polarized (e.g., linearpolarization, circular polarization, etc.) light, partially polarizedlight, or nonpolarized light; and/or light with different degrees oftemporal and/or spatial coherence ranging from coherent light (e.g.,laser) to noncoherent light. As provided herein, a photon detector arrayor a light detector array may be used in conjunction with one or moreoptical components of an optical setup to detect light having any of theforegoing qualities.

The photon detector array may include a number of pixel sensors, whichpixel sensors, in turn, may each include a photon detector (e.g., aphotodiode) coupled to a circuit including a transistor configured foramplification. Features of a photon detector array including such pixelsensors include, but are not limited to, low temperature operation(e.g., down to −40° C.), low electron noise (e.g., 2-10 e⁻ RMS; 1 e⁻RMS; <1 e⁻ RMS; etc.), wide dynamic range (e.g., 30,000:1, 8,500:1;3,000:1; etc.), and/or decreased photon/light collection time. A photondetector array may include a large number of pixel sensors (e.g.,≧1,000,000 or ≧1M pixel sensors) arranged in rows and columns of atwo-dimensional array, wherein each pixel sensor includes a photondetector coupled to an amplifier. In some non-limiting embodiments, forexample, a photon detector array may include at least 1M, 2M, 3M, 4M,5M, 6M, 7M, 8M, 9M, 10M, or more, pixel sensors arranged in rows andcolumns of a two-dimensional array. In some non-limiting embodiments,for example, a photon detector array may include no more than 10M, 9M,8M, 7M, 6M, 5M, 4M, 3M, 2M, or 1M, pixel sensors arranged in rows andcolumns of a two-dimensional array. Combinations of the foregoing mayalso be used to describe the number of pixel sensors in a photondetector array. In some non-limiting embodiments, for example, a photondetector array may include at least 1M and no more than 10M (e.g.,between 1M and 10M) pixel sensors arranged in rows and columns of atwo-dimensional array, such as at least 1M and no more than 8M (e.g.,between 1M and 8M) pixel sensors, including at least 1M and no more than6M (e.g., between 1M and 6M) pixel sensors, further including at least2M and no more than 6M (e.g., between 2M and 6M) pixel sensors, and evenfurther including at least 2M and no more than 5M (e.g., between 2M and5M) pixel sensors.

Due to small angle scattering (e.g., 4π scattering) features may appearmuch larger in size enabling pixel sensors larger the than features tobe used. In some non-limiting embodiments, for example, a photondetector array may include micrometer-sized (i.e., admits of μm units asmeasured) pixel sensors at least 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7μm, 8 μm, 9 μm, or 10 μm in their smallest dimension. In somenon-limiting embodiments, for example, a photon detector array mayinclude micrometer-sized pixel sensors no more than 10 μm, 9 μm, 8 μm, 7μm, 6 μm, 5 μm, 4 μm, 3 μm, 2 μm, or 1 μm in their smallest dimension.Combinations of the foregoing may also be used to describe dimensions ofmicrometer-sized pixel sensors in photon detector arrays. In somenon-limiting embodiments, for example, a photon detector array mayinclude micrometer-sized pixel sensors at least 1 μm and no more than 10μm (e.g., between 1 μm and 10 μm) in their smallest dimension, such asat least 1 μm and no more than 7 μm (e.g., between 1 μm and 7 μm),including at least 4 μm and no more than 10 μm (e.g., between 4 μm and10 μm), and further including at least 4 μm and no more than 7 μm (e.g.,between 4 μm and 7 μm). Such micrometer-sized pixel sensors may be usedin the apparatus for detecting, mapping, and/or distinguishing featuresof articles, wherein the features are more than 100 times smaller thanthe micrometer-sized pixel sensors.

In view of the foregoing, the single photon detector array or the numberof photon detector arrays may each include a complementary metal-oxidesemiconductor (“CMOS”) or a scientific complementary metal-oxidesemiconductor (“sCMOS”), each of which may be optionally part of a CMOScamera or a sCMOS camera, respectively. Alternatively, the single photondetector array or the number of photon detector arrays may each includea charge-coupled device (“CCD”), which may optionally be part of CCDcamera. While a CCD-based photon detector array might have a slowerrecording speed than a CMOS-based or sCMOS-based photon detector array,a CCD-based photon detector array may be desirable in applicationsrequiring less electronic and/or image noise. A CCD-based photondetector array, including an electron-multiplying CCD (“EMCCD”), mayalso be desirable in certain applications having low-light conditions.Furthermore, a number of photon detector arrays is not limited tocombinations of either CMOS/sCMOS-based photon detector arrays orCCD-based photon-detector arrays, as a number of photon detector arraysmay include a combination of any of a number of CMOS/sCMOS-based photondetector arrays and CCD-based photon-detector arrays in applicationsthat benefit from employing each type of technology. In somenon-limiting embodiments, for example, a CMOS/sCMOS-based photondetector array may be used to detect photons scattered from features ofarticles in certain applications having sufficient light for theCMOS/sCMOS-based photon detector array, while a CCD/EMCCD-based photondetector array may be used to detect photons scattered from features ofarticles in certain applications having too little light for theCMOS/sCMOS-based photon detector array.

FIG. 3 provides a schematic for detection of features of an article,illustrating a close-up, cross-sectional view of an apparatus includingan optical setup and a photon detector array as provided herein. Asshown, article 160 includes a surface 162 and one or more features suchas feature 164 (e.g., surface feature, magnetic feature, etc.). Photonsmay be scattered by the features and collected and detected by acombination including a lens coupled to a photon detector array 130,which combination may be positioned at a distance and/or an angle for anoptimum acceptance of the scattered photons (e.g., maximum acceptance ofphotons with minimum background noise, including noise from reflectedphotons) from one or more types of features. The optical setup, whichmay include a telecentric lens (e.g., the lens of the optical setup 120of FIG. 1), may collect and focus the photons scattered from one or morefeatures onto one or more pixel sensors 132 of photon detector array130, which one or more pixel sensors may each include a photon detectorcoupled to an amplifier (e.g., CMOS/sCMOS-based photon detector array;EMCCD-based photon detector array; etc.). The one or more pixel sensors132, each of which may correspond to a particular, fixed area of anarticle's surface and a pixel in a features map of the article, mayprovide one or more signals to a computer or equivalent device formapping an article's features or otherwise determining the position ofone or more features of the article.

Depending upon factors that may include the type of article, the type ofsurface features (e.g., particle, stain, scratch, void, etc.), the typeof magnetic features, and the like, it may be desirable at times toincrease detection time of a single photon detector array or a number ofphoton detector arrays to detect more photons for detecting, mapping,and/or distinguishing features of articles. In some non-limitingembodiments, for example, detection time of a single photon detectorarray or a number of photon detector arrays may be increased to detectmore photons. In such embodiments, a CCD-based photon detector array,including an electron-multiplying EMCCD may be used to further detectmore photons. Alternately or additionally, it may be desirable toincrease the number of photons (e.g., photon energy) emitted from asingle photon emitter or a number of photon emitters to provide anincrease in photons scattered for detecting, mapping, and/ordistinguishing features of articles. Such an increase in photon energymay be with respect to unit time for increased photon power, or withrespect to unit area for increased photon flux density. Alternately toone or both of increasing the photon energy or detection time, or inaddition to increasing the photon energy and detection time, it may bedesirable at times to minimize background noise including stray lightfrom one or more photon emitters, reflected light from the surface ofthe article, background light, and/or background fluorescent radiation.

The apparatus may further include one or more computers or equivalentdevices (e.g., devices that include primary and/or secondary memory andone or more processing elements operable to carry out arithmetic andlogical operations), including, but not limited to, servers,workstations, desktop computers, nettops, laptops, netbooks, and mobiledevices such as tablets and smartphones, which computers or equivalentdevices may contain graphics processing units (“GPU”s),application-specific integrated circuits (“ASIC”s), field-programmablegate arrays (“FPGA”s), etc. The computers or equivalent devices mayinclude a computer-readable storage medium for instructions making theapparatus operable to, but not limited to, convey each article to theapparatus for inspection; position each article for inspection,optionally including gradational or continuous rotation of the articlewith respect to the photon emitter(s); hold or otherwise maintain theposition of each article for inspection; insert optical components intothe optical setup, for example, using a mechanical actuator; positionoptical components for inspection; adjust optical components (e.g.,focus lenses) and/or tune optical components (e.g., piezoelectric-basedwavelength filters; piezoelectric-based polarization filters; etc.) forinspection; remove optical components from the optical setup; move eachphoton emitter into position for inspection, wherein the position forinspection may include a photon emitter-article distance and/or angle(e.g., glancing angle) optimized for one or more types of features;switch each photon emitter on and off, or otherwise between modes foremitting photons and not emitting photons; move each photon detectorarray into position for inspection, wherein the position for inspectionmay include a photon detector array-article distance and/or angle (e.g.,scatter angle) optimized for one or more types of features; switch eachphoton detector array on and off, or otherwise between modes fordetecting photons and not detecting photons; synchronize each photonemitter with each photon detector in accordance with a photonemission-photon detection scheme; process photon-detector-array signalsor derivative signals thereof corresponding to scattered photons,optionally including pixel interpolation for better accuracy (e.g., 10×better than pixel size) with respect to the position of features; map orotherwise determine the position of features of articles fromphoton-detector-array signals or derivative signals thereof;quantitatively and/or qualitatively characterize features of articles;catalog features of articles; and determine trends with respect tofeatures of articles.

The one or more computers or equivalent devices may generate a featuresmap such as a surface features map using photon-detector-array signalsor derivative signals thereof corresponding to photons scattered fromone or more types of surface features. FIG. 4A provides an image of sucha surface features map, FIG. 4B further provides a close-up image ofsuch a surface features map (e.g., a close-up image of the surfacefeatures map of FIG. 4A), and FIG. 4C (top) even further provides acloser, close-up image of such a surface features map (e.g., a close-upimage of the surface features map of FIG. 4B), wherein the close-upimage of FIG. 4C is centered about a single surface feature (e.g.,feature 164 of FIG. 3). The one or more computers or equivalent devicesmay subsequently use pixel interpolation for further mapping surfacefeatures such as the surface feature provided in FIG. 4D (top). Asevidenced by inspection of the close-up images of the surface feature inFIGS. 4C (top) and 4D (top), pixel interpolation increases pixelresolution for the surface features map to which it is applied,importantly without an increase in pixel sensors in the photon detectorarray. Such pixel interpolation may further increase resolution forphoton scattering intensity distributions as evidenced by inspection ofthe photon scattering intensity distributions in FIGS. 4C (bottom) and4D (bottom) respectively for the surface feature of FIGS. 4C (top) and4D (bottom).

The one or more computers or equivalent devices may generate a featuresmap such as a magnetic features map using photon-detector-array signalsor derivative signals thereof corresponding to photons scattered fromone or more types of magnetic features. FIG. 5B provides an image ofsuch a magnetic features map, wherein photons scattered by magneticfeatures across an inner diameter band and an outer diameter band of anannular or disk-shaped article (e.g., hard disk for a hard disk drive)indicates correctly written magnetic information (e.g., by a diskcertifier for hard disk certification), and wherein a lack of photonsscattered across a middle band of the article indicates one or moremagnetic anomalies, including, but not limited to, magnetic defects andincorrectly written magnetic information. FIG. 5C provides magneticforce microscopy (“MFM”) images for the inner diameter band, the middleband, and the outer diameter band overlaying the image of the magneticfeatures map of FIG. 5B. The MFM images of FIG. 5C further provideevidence that the inner diameter band and the outer diameter band of thearticle includes correctly written magnetic information (e.g., by a diskcertifier for hard disk certification), while the middle band of thearticle includes magnetic anomalies.

It was surprisingly discovered that articles including magnetic featuressuch as the article of FIG. 5B scatter photons orthogonally incidentupon the magnetic features or certain magnetic field lines thereof. FIG.2B provides a schematic illustrating this surprising discovery, in whichphotons in one of a number of rays or hv_(incident) emitted onto asurface 162 of an article 160 are scattered in a number of rays orhv_(scattered) by features 164 such as magnetic features 164 includingmagnetic domains 166, to which magnetic features 164 or certain magneticfield lines 168 thereof the photons in the one of the number of rays orhv_(incident) are orthogonal. Without being bound by theory, the photonsin the one of the number of rays emitted onto the surface of the articleinteract with the magnetic field lines of magnetic features, therebyallowing the magnetic features to scatter photons. Further without beingbound by theory, tightly packed or dense arrangements of magneticdomains and magnetic transitions between them in magnetic recordingmedia, including, but not limited to, longitudinal magnetic recordingmedia (“LMR”), perpendicular magnetic recording media (“PMR”),heat-assisted magnetic recording media (“HAMR”), discrete trackrecording media (“DTR”), and bit-patterned media (“BPM”), makes possibleor enhances the scattering of photons by magnetic features.

Turning back to FIG. 5B and without being bound by theory, the lack ofphotons scattered across the middle band of the article may be explainedby reference to FIG. 5A, which provides a schematic illustrating a lackof photon scattering from a magnetic anomaly 165 about a surface 162 ofa portion of an article 160. As illustrated in FIG. 5A, magnetic domains166 may be arranged in tracks by like polarizations (e.g., “↓” and “↑”)such as tracks magnetically written by a disk certifier for hard diskcertification. Magnetic transitions between the magnetic domains 166 areillustrated in FIG. 5A by magnetic field lines 168 forming magneticfeatures 164, which magnetic features 164 scatter photons as providedherein. However, since the magnetic anomaly 165 does not share amagnetic transition with one or more magnetic domains 166, the magneticanomaly 165 does not form a magnetic feature 164, and the magneticanomaly 165 does not scatter photons. In this non-limiting example, themagnetic anomaly may be an artifact of article fabrication such as amagnetic defect resulting from faulty magnetic stack construction in theregion of the article corresponding to the magnetic anomaly.Alternatively or in addition, the magnetic anomaly may be incorrectlywritten magnetic information such as incorrectly written magneticinformation by a disk certifier for hard disk certification.

Turning to FIG. 6 and without being bound by theory, FIG. 6 provides aschematic illustrating photon scattering from a magnetic anomaly 165about a surface 162 of a portion of an article 160. Magnetic domains(e.g., magnetic domains 166) of the article may be oriented in onepolarization or an opposite polarization (e.g., “↓” or “↑”) by DCmagnetization of the article, for example, a hard disk for a hard diskdrive. Ideally, DC magnetization of the article removes magnetictransitions between nearby magnetic domains encouraging magnetic fieldlines (e.g., magnetic field line 168) of the magnetic domains to insteadclose over and back under the article, for example, over and back underthe inner and outer circumferences of the hard disk. However, weak orpoorly constructed magnetic domains of the article may spontaneouslychange polarization after DC magnetization allowing for magnetictransitions between DC magnetized magnetic domains and the weak orpoorly constructed magnetic domains. In other words, the weak or poorlyconstructed magnetic domains may spontaneously change polarization afterDC magnetization allowing for magnetic field lines of nearby magneticdomains to close through the surface of the article and through the weakor poorly constructed magnetic domains instead of over and back underthe article. On account of magnetic transitions between DC magnetizedmagnetic domains and the weak or poorly constructed magnetic domains,magnetic anomalies (e.g., magnetic anomaly 165) including the weak orpoorly constructed magnetic domains scatter photons as described hereinfor magnetic features (e.g., magnetic feature 164).

Articles such as hard disks having servo patterns in servo sectors,including, but not limited to servo patterns corresponding to one ormore servo sector fields selected from an automatic gain control (“AGC”)field, a servo timing mark (“STM”) field, a Gray-coded track numberfield, and a position error signal (“PES”) burst pattern field may beinspected for detecting, mapping, and/or distinguishing magneticfeatures. In some non-limiting embodiments, for example, Gray-codedtrack number fields of hard disks, which fields include successive tracknumbers differing only in a single bit, may be inspected for magneticanomalies. In such embodiments, magnetic features of the Gray-codedtrack number fields predictably vary in accordance with successive tracknumbers differing only in a single bit. Any magnetic features of theGray-coded track number fields not in accordance with expected magneticfeatures may be considered magnetic anomalies.

Since FIG. 5A provides a schematic illustrating a lack of photonscattering from a magnetic anomaly and FIG. 6 provides a schematicillustrating photon scattering from a magnetic anomaly, it should beunderstood that magnetic anomalies of articles may present differentlyaccording to the scenario under which the articles are inspected. Andwhile FIG. 5A and FIG. 6 present two such scenarios, it should befurther understood that apparatuses and methods provided herein are notlimited thereto.

The apparatus may be configured for detecting, mapping, and/ordistinguishing features of articles, wherein the features arenanometer-sized (i.e., admits of nm units as measured) or smaller intheir smallest dimension (e.g., length, width, height, or depth,depending on the feature), which features may be smaller than thewavelength of photons emitted from a photon emitter of the apparatus.However, the apparatus is not limited to features of articles that arenanometer-sized or smaller, as the apparatus may be configured fordetecting, mapping, and/or distinguishing features of articles, whereinthe features are micrometer-sized (i.e., admits of μm units as measured)or larger. In some non-limiting embodiments, for example, the apparatusmay be configured for detecting, mapping, and/or distinguishing featuresof articles, wherein the features are smaller than 500 nm, 250 nm, 200nm, 150 nm, 125 nm, 110 nm, 100 nm, 90 nm, 80 nm, 70 nm, 60 nm, 50 nm,40 nm, 30 nm, 20 nm, 10 nm, or 1 nm (10 Å) in their smallest dimension,or even smaller, such as features of articles smaller than 9 Å, 8 Å, 7Å, 6 Å, 5 Å, 4 Å, 3 Å, 2 Å, or 1 Å in their smallest dimension. In viewof the foregoing, and in some non-limiting embodiments, for example, theapparatus may be configured for detecting, mapping, and/ordistinguishing features of articles, wherein the features are between0.1 nm and 1000 nm, such as between 0.1 nm and 500 nm, including between0.1 nm and 250 nm, and further including between 0.1 nm and 100 nm, andeven further including between 0.1 nm and 80 nm. Furthermore, theapparatus may be configured for detecting, mapping, and/ordistinguishing features having a depth more than 1 nm, 2 nm, 3 nm, 4 nm,5 nm, 6 nm, 7 nm, 8 nm, 9 nm, or 10 nm, or deeper, below an article'ssurface.

The apparatus may be configured for detecting, mapping, and/ordistinguishing surface features of articles, including surface and/orsubsurface defects including particle contamination in which theparticles are nanometer-sized (i.e., admits of nm units as measured) orsmaller in their smallest dimension (e.g., length, width, or height). Insome non-limiting embodiments, for example, the apparatus may beconfigured for detecting, mapping, and/or distinguishing surface and/orsubsurface particles smaller than 125 nm, such as smaller than 100 nm,including smaller than 80 nm, and further including smaller than 10 nmin their smallest dimension. Detecting, mapping, and/or distinguishingsurface and/or subsurface particles down to the level of 10 nm in heightis important for hard disks of hard disk drives, as particles greaterthan 10 nm in height (e.g., from the surface) may corrupt the spacingbetween the hard disk and the read-write head of a hard disk drive. Insome non-limiting embodiments, for example, the apparatus may beconfigured for detecting, mapping, and/or distinguishing surface and/orsubsurface particles as small as or smaller than 4 nm in height.

The apparatus may be configured for detecting, mapping, and/ordistinguishing surface features of articles, including surface and/orsubsurface defects including scratches (e.g., circumferential scratches)that are micrometer-sized (i.e., admits of μm units as measured) orsmaller, such as nanometer-sized (i.e., admits of nm units as measured)or smaller, such as angstrom-sized (i.e., admits of Å units as measured)or smaller, in their smallest dimension (e.g., length, width, or depth).With respect to micrometer-sized scratches, the apparatus may beconfigured for detecting, mapping, and/or distinguishing scratches from,for example, 1 μm to 1000 μm in length, which may be significantlylonger than the wavelength of photons emitted from a photon emitter ofthe apparatus. In some non-limiting embodiments, for example, theapparatus may be configured for detecting, mapping, and/ordistinguishing scratches smaller than 1000 μm, such as smaller than 500μm, including smaller than 250 μm, further including smaller than 100μm, and even further including smaller than 50 μm in scratch length.With respect to nanometer-sized scratches, the apparatus may beconfigured for detecting, mapping, and/or distinguishing scratches from,for example, 1 nm to 500 nm in scratch width. In some non-limitingembodiments, for example, the apparatus may be configured for detecting,mapping, and/or distinguishing scratches smaller than 500 nm, such assmaller than 250 nm, including smaller than 100 nm, further includingsmaller than 50 nm, and even further including smaller than 15 nm inscratch width. Surprisingly, due to a high level of spatial coherence,the apparatus may be configured for detecting, mapping, and/ordistinguishing angstrom-sized scratches with respect to scratch depth.In some non-limiting embodiments, for example, the apparatus may beconfigured for detecting, mapping, and/or distinguishing scratchessmaller than 50 Å, such as smaller than 25 Å, including smaller than 10Å, further including smaller than 5 Å, and even further includingsmaller than 1 Å (e.g., 0.5 Å) in scratch depth. For example, theapparatus may be configured for detecting, mapping, and/ordistinguishing scratches smaller than 500 μm in length, smaller than 100nm in width, and smaller than 50 Å in depth.

The apparatus may be operable to accurately and/or precisely map orotherwise determine the position of a feature (e.g., surface feature inFIGS. 4C [top] and 4D [top]) about an article, optionally using pixelinterpolation. With respect to accuracy, the apparatus may be operableto map or otherwise determine the position of a feature about an articlewithin a micrometer-sized (i.e., admits of μm units as measured) radiusor better. In some non-limiting embodiments, for example, the apparatusmay be operable to accurately map or otherwise determine the position ofa feature about an article within a radius of 100 μm, 90 μm, 80 μm, 70μm, 60 μm, 50 μm, 40 μm, 30 μm, 20 μm, 10 μm, 9 μm, 8 μm, 7 μm, 6 μm, 5μm, 4 μm, 3 μm, 2 μm, or 1 μm, or better. Combinations of the foregoingmay also be used to describe the accuracy with which the apparatus maymap or otherwise determine the position of a feature about an article.In some non-limiting embodiments, for example, the apparatus may beoperable to accurately map or otherwise determine the position of afeature about an article within a radius ranging from 1 μm to 100 μm,such as from 1 μm to 50 μm, including from 1 μm to 30 μm, and furtherincluding from 5 μm to 10 μm.

In addition to accurately and/or precisely mapping or otherwisedetermining the position of a feature about an article, the apparatusmay be operable to accurately and/or precisely determine the photonscattering intensity distribution (e.g., FIGS. 4C [bottom] and 4C[bottom]) of the feature about the article. Such a photon scatteringintensity distribution may be used to characterize a feature about anarticle quantitatively and/or qualitatively, which, in turn, may be usedfor distinguishing features of articles.

With respect to quantitative characterization of a feature of anarticle, mathematical integration of a photon scattering intensitydistribution provides the size (e.g., volume) of the feature of thearticle. Quantitative characterization of a feature of an article mayfurther include a determination of feature position about the article asdescribed herein. Quantitative characterization may even further includethe total number of features per article, or the number of features perunit area per article (e.g., feature density), as well as the number ofeach type of feature per article. Such characterization information maybe cataloged across a number of articles and be used to correctmanufacturing trends should such features include defects (e.g.,magnetic anomalies, surface defects, and/or subsurface defects) thatmight degrade the performance of the article.

With respect to qualitative characterization of a feature of an articlesuch as a surface feature, qualitative characterization may include adetermination whether the surface feature is a particle, a stain, ascratch, a void, etc., which determination may be effected by, but isnot limited to, analysis of the feature's photon scattering intensitydistribution. Qualitative characterization may further include chemicalcharacterization of surface features known to differentially scatterphotons such as, but not limited to, certain oxides, which may havefaceted surfaces that differentially and/or directionally scatterphotons depending upon rotational orientation to the photon emitter(s).Qualitative characterization may even further include distinguishingbetween surface features known to differentially scatter photons withrespect to wavelength, polarization, coherence, and/or phase. Awavelength filter may be used to distinguish between surface featuresknown to differentially scatter photons with respect to wavelength; apolarization filter may be used to distinguish between surface featuresknown to differentially scatter photons with respect to polarization; acoherence filter may be used to distinguish between surface featuresknown to differentially scatter photons with respect to coherence; and aphase filter or waveplate may be used to distinguish between surfacefeatures known to differentially scatter photons with respect to phase.In some non-limiting embodiments, for example, qualitativecharacterization of one or more surface features of an article mayinclude contrasting photon-scattering information in the effectiveabsence of one of the foregoing filters with photon-scatteringinformation using one or more of the foregoing filters or contrasting afirst surface features map produced in the effective absence of one ofthe foregoing filters with a second surface features map (or a number ofsurface features maps) produced using one or more of the foregoingfilters. Along with quantitative characterization information, suchqualitative characterization information may be cataloged across anumber of articles and be used to correct manufacturing trends shouldfeatures include defects (e.g., magnetic anomalies, surface defects,and/or subsurface defects) that might degrade the performance of thearticle.

The apparatus described herein may be configured to process or inspectarticles at a rate greater than or commensurate with the rate at whichthe articles or workpieces thereof are produced. In some non-limitingembodiments, for example, the apparatus may be configured to process orinspect articles at a rate of at least 1, 2, 3, 4, 5, 6, 7, 8, 9, 10,12, 14, 16, 18, or 20, or higher, article(s) per second, which rate maybe commensurate with the rate at which the articles or workpiecesthereof are produced. In some non-limiting embodiments, for example, theapparatus may be configured to process or inspect articles at a rate ofno more than 20, 18, 16, 14, 12, 10, 9, 8, 7, 6, 5, 4, 3, 2, or 1article(s) per second, which rate may be commensurate with the rate atwhich the articles or workpieces thereof are produced. Combinations ofthe foregoing may also be used to describe the rate at which thearticles or workpieces thereof are processed or inspected by theapparatus. In some non-limiting embodiments, for example, the apparatusmay be configured to process or inspect at least 1 and no more than 20articles per second (e.g., between 1 and 20 articles per second), suchas at least 1 and no more than 10 articles per second (e.g., between 1and 10 articles per second), including at least 1 and no more than 5articles per second (e.g., between 1 and 5 articles per second).Processing or inspecting articles at rates greater than or commensuratewith the rate at which the articles or workpieces thereof are producedis a function of many features of the apparatus described herein,including, but not limited to, photon emitters and/or articles that neednot be moved (e.g., for scanning) during processing or inspecting. Forexample, with a number of photon emitters arranged at regular intervalsaround an article, the article need not be rotated during processing orinspecting. As such, the apparatus may be configured to hold an articlestationary while emitting photons onto the surface of the article.

As such, provided herein is an apparatus, comprising a photon emitterconfigured to emit photons onto a surface of an article; a photondetector array configured to receive photons scattered from the article;and a processing means operably connected to the photon detector array,wherein the apparatus is operable to detect magnetic anomalies amongmagnetic features of the article. In some embodiments, the apparatusfurther comprises a stage configured to rotate the article with respectto the photon emitter. In some embodiments, the photon emitter isfurther configured to emit photons orthogonally to magnetic field linesof the magnetic features. In some embodiments, the apparatus furthercomprises a telecentric lens operably connected to the photon detectorarray. In some embodiments, the processing means comprises a processorconfigured to execute arithmetic and logical operations onphoton-detector-array signals or derivative signals thereofcorresponding to the photons received by the photon detector array. Insome embodiments, the processing means is operable to generate at leastone magnetic features map of the article. In some embodiments, theapparatus is further operable to detect surface features about thesurface of the article, and wherein the surface features are selectedfrom a group consisting of particles, stains, scratches, and voids. Insome embodiments, the processing means is operable to generate at leastone surface features map of the article.

Also provided is an apparatus, comprising a photon emitting meansconfigured to emit photons onto a surface of an article; a photondetector array configured to receive photons scattered from the surfaceof the article; and a processing means operably connected to the photondetector array, wherein the apparatus is operable to detect magneticanomalies among magnetic features of the article. In some embodiments,the photon emitting means is configured to emit photons orthogonally tomagnetic field lines of the magnetic features. In some embodiments, thephoton emitting means comprises a photon emitter and a stage, whereinthe stage is configured to rotate the article with respect to the photonemitter. In some embodiments, the apparatus further comprises atelecentric lens operably connected to the photon detector array. Insome embodiments, the processing means comprises a processor configuredto execute arithmetic and logical operations on photon-detector-arraysignals or derivative signals thereof corresponding to the photonsreceived by the photon detector array. In some embodiments, theprocessing means is operable to generate at least one features map ofthe article, wherein the features of the features map comprise magneticfeatures, surface features, or a composite features map thereof.

Also provided is an apparatus, comprising a photon emitting meansconfigured to emit photons, wherein the photons are scattered frommagnetic features of an article; a photon detector array configured toreceive scattered photons; and a processing means configured todifferentiate the magnetic features from the scattered photons. In someembodiments, the photon emitting means is further configured to emitphotons orthogonally to magnetic field lines of the magnetic features.In some embodiments, the photon emitting means comprises a photonemitter and a stage, wherein the stage is configured to rotate thearticle with respect to the photon emitter. In some embodiments, theapparatus further comprises a telecentric lens operably connected to thephoton detector array. In some embodiments, the processing meanscomprises a processor configured to execute arithmetic and logicaloperations on photon-detector-array signals or derivative signalsthereof corresponding to the photons received by the photon detectorarray. In some embodiments, the processing means is operable to generateat least one features map of the article, wherein the features of thefeatures map comprise magnetic features, surface features, or acomposite features map thereof.

Also provided is an apparatus, comprising a photon detector arrayconfigured to receive photons scattered from an article; and aprocessing means operably connected to the photon detector array,wherein the apparatus is operable to detect magnetic anomalies amongmagnetic features of the article. In some embodiments, the apparatusfurther comprises a photon emitter configured to emit photons onto thesurface of the article. In some embodiments, the apparatus furthercomprises a stage configured to position the article with respect to thephoton emitter such that the photons are emitted orthogonally tomagnetic field lines of the magnetic features. In some embodiments, theapparatus further comprises a telecentric lens operably connected to thephoton detector array. In some embodiments, the processing meanscomprises a processor configured to execute arithmetic and logicaloperations on photon-detector-array signals or derivative signalsthereof corresponding to the photons received by the photon detectorarray. In some embodiments, the processing means is operable to generateat least one features map of the article, wherein the features of thefeatures map comprise magnetic features, surface features, or acomposite features map thereof.

While some particular embodiments have been described and/or illustratedherein, and while these particular embodiments have been describedand/or illustrated in considerable detail, it is not the intention forthese particular embodiments to limit the scope of the conceptspresented herein. Additional adaptations and/or modifications mayreadily appear to persons having ordinary skill in the art, and, inbroader aspects, these adaptations and/or modifications may beencompassed as well. Accordingly, departures may be made from theforegoing embodiments without departing from the scope of the conceptsprovided herein. The implementations provided herein and otherimplementations are within the scope of the following claims.

What is claimed is:
 1. An apparatus, comprising: a photon emitterconfigured to emit photons onto a surface of an article; a photondetector array configured to receive photons scattered from the article;and a processing means operably connected to the photon detector array,wherein the apparatus is operable to detect magnetic anomalies amongmagnetic features of the article.
 2. The apparatus of claim 1, furthercomprising a stage configured to rotate the article with respect to thephoton emitter.
 3. The apparatus of claim 1, wherein the photon emitteris further configured to emit photons orthogonally to magnetic fieldlines of the magnetic features.
 4. The apparatus of claim 1, furthercomprising a telecentric lens operably connected to the photon detectorarray.
 5. The apparatus of claim 1, wherein the processing meanscomprises a processor configured to execute arithmetic and logicaloperations on photon-detector-array signals or derivative signalsthereof corresponding to the photons received by the photon detectorarray.
 6. The apparatus of claim 1, wherein the processing means isoperable to generate at least one magnetic features map of the article.7. The apparatus of claim 1, wherein the apparatus is further operableto detect surface features about the surface of the article, and whereinthe surface features are selected from a group consisting of particles,stains, scratches, and voids.
 8. The apparatus of claim 7, wherein theprocessing means is operable to generate at least one surface featuresmap of the article.
 9. An apparatus, comprising: a photon emitting meansconfigured to emit photons, wherein the photons are scattered frommagnetic features of an article; a photon detector array configured toreceive scattered photons; and a processing means configured todifferentiate the magnetic features from the scattered photons.
 10. Theapparatus of claim 9, wherein the photon emitting means is furtherconfigured to emit photons orthogonally to magnetic field lines of themagnetic features.
 11. The apparatus of claim 10, wherein the photonemitting means comprises a photon emitter and a stage, wherein the stageis configured to rotate the article with respect to the photon emitter.12. The apparatus of claim 10, further comprising a telecentric lensoperably connected to the photon detector array.
 13. The apparatus ofclaim 10, wherein the processing means comprises a processor configuredto execute arithmetic and logical operations on photon-detector-arraysignals or derivative signals thereof corresponding to the photonsreceived by the photon detector array.
 14. The apparatus of claim 10,wherein the processing means is operable to generate at least onefeatures map of the article, wherein the features of the features mapcomprise magnetic features, surface features, or a composite featuresmap thereof.
 15. An apparatus, comprising: a photon detector arrayconfigured to receive photons scattered from an article; and aprocessing means operably connected to the photon detector array,wherein the apparatus is operable to detect magnetic anomalies amongmagnetic features of the article.
 16. The apparatus of claim 15, furthercomprising a photon emitter configured to emit photons onto the surfaceof the article.
 17. The apparatus of claim 16, further comprising astage configured to position the article with respect to the photonemitter such that the photons are emitted orthogonally to magnetic fieldlines of the magnetic features.
 18. The apparatus of claim 15, furthercomprising a telecentric lens operably connected to the photon detectorarray.
 19. The apparatus of claim 15, wherein the processing meanscomprises a processor configured to execute arithmetic and logicaloperations on photon-detector-array signals or derivative signalsthereof corresponding to the photons received by the photon detectorarray.
 20. The apparatus of claim 15, wherein the processing means isoperable to generate at least one features map of the article, whereinthe features of the features map comprise magnetic features, surfacefeatures, or a composite features map thereof.